With highly integrated IC, the chip and the
package size is increased, the shell of the encapsulation layer, and to further
reduce the price request for a higher molding and comprehensive requirements,
as follows.
1) moldability fluidity, curability, mold
release properties, mold contamination habits, metal abrasion resistance,
storage stability of the material, and so the appearance of the package.
(2) Heat resistance
(3) Moisture Resistance
(4) corrosion resistance
(5) adhesive
(6) The electrical characteristics under a
variety of environmental electrical insulation, high-frequency characteristics,
charging and so on.
(7) mechanical properties of tensile and
flexural properties (strength and elastic retention of the green temperature),
impact strength.
(8) Other printability (ink, laser), flame
resistance, soft, elastic, non-toxic and low-toxicity, low cost, color and so
on.
From the integrated nature of the
substrate, the current IC package with more o-cresol formaldehyde epoxy resin
system, but because of the characteristics of epoxy resin, making the
temperature resistance, technology, curing conditions, mobility package ,
shrinkage of the cured product, there are some applications disadvantages. To
solve these problems Fu Chen Shanghai Chemical Company has developed a new
packaging insulating resin, the resin has good technology to facilitate curing,
good liquidity, low cure shrinkage characteristics of epoxy resin has been
widely alternatives become the new darling of the industry.
more information www.plastic-injectionmoulding.com www.chinamoldmaker.org
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